Waferpedia

Comparison ledger

3220versusDFD 6360 Automatic Dicing

Disco 3220, Disco DFD 6360 Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
3220Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 3220Disco DFD 6360
Specifications
equipment typedicing saw[1]—
Workplace sizeø150 mm[2]—
Spindle layoutSingle[2]—
Spindle output1.5 kW at 30,000 min-1[2]—
Spindle max revolution speed40,000 min-1[2]—
X-axis feed speed range0.1 – 500 mm/s[2]—
Y-axis index step0.0001 mm[2]—
Z-axis repeating accuracy0.001 mm[2]—
Z-axis max blade sizeø58 mm[2]—
Phase—3 Phase[3]
Configuration—50/60 Hz[4]
Type—Automatic Dicing Saw[5]
Power—3 Phase[3]
Frequency—50/60 Hz[4]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]Equipment inventory listing