Comparison ledger
Disco 321, Strasbaugh 7 AF Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 321Disco | 7 AF WaferStrasbaugh |
|---|---|---|
| OEM | Disco | Strasbaugh |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | Wafer handler |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 321 | Strasbaugh 7 AF Wafer |
| Specifications | ||
| OEM | Disco[1] | — |
| Model | 321[1] | — |
| Equipment type | Wafer Dicing Saw[1] | Wafer grinder[4] |
| Facility context | Cleanroom Instrumentation[1] | — |
| Application area | Nano and Micro Fabrication[1] | — |
| Location | FNT 4.106[1] | — |
| Wafer Size | Up to 6 inches[2] | — |
| Spindle Power | 1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[3] | — |
| Spindle Power (alternate) | 1500 Watt spindle[2] | — |
| Non-Contact Setup | Non Contact Setup[3] | — |
| Microscope | Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[3] | — |
| Broken Blade Detection | Broken Blade Detection[3] | — |
| Light Tower | Includes Light Tower[3] | — |
| Chuck Type | 6" Universal Chuck (or 6" Porous Film Frame Chuck)[2] | — |
| Wafer size capability | Up to 6" wafers[3] | — |
| Chuck | 6-inch porous film frame chuck[2] | — |
| Spindle power | 1500-watt spindle[2] | — |
| Footprint | Small footprint[2] | — |
| Setup | Non-contact setup[3] | — |
| Blade break detection | Broken blade detection[3] | — |
| Other features | Floppy drive, light tower, blade tools, manuals[3] | — |
| Date of Audit | — | 9/12/25[4] |
| Configuration | — | Can produce wafers as-is[4] |
| Wafer size | — | Wafer handler[4] |
| Robot Type | — | Genmark[4] |
| SystemSW (App) Version | — | 7.25.0[4] |
| Power | — | 208 V, 3 phase, 60 Hz[4] |
| Frequency | — | 60 Hz[5] |
| Phase | — | 3 Phase[5] |
| Voltage | — | 230 V[5] |
| Full Load Amp | — | 45 A[5] |
| Tapeless backgrinding | — | Listed[5] |
| In-feed technology | — | Listed[5] |
| In-situ thickness control | — | Listed[5] |
| Force adaptive grinding | — | Listed[5] |
| Linear traversing grind spindles | — | Listed[5] |
| Automated process control | — | Listed[5] |
| Thin wafer handling | — | Listed[5] |
| Wafer handler | — | Listed[4] |
| Cassette / FOUP loaders | — | 2[4] |
| Pre-aligner | — | Listed[4] |
| Mini environment | — | Listed[4] |
| SystemSW version | — | 7.25.0[4] |
| GEM / SECS | — | Listed[4] |
| Ethernet | — | Listed[4] |
| Heat exchange / chiller | — | Listed[4] |
| CDA | — | Listed[4] |
| DIW | — | Listed[4] |
| Vacuum | — | Listed[4] |
| Full load amp | — | 20 A[6] |
| No field modifications | — | Listed[4] |
| No power supply | — | Listed[4] |
| No external transformer | — | Listed[4] |
| No UPS | — | Listed[4] |
| No corrosion visible on modules | — | Listed[4] |
| No backing pumps | — | Listed[4] |
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