Waferpedia

Comparison ledger

321versusDTG 8460 Taiko

Disco 321, Disco DTG 8460 Taiko, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
321Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 321Disco DTG 8460
Cited variants—
  • DTG 8460 Wafer Backside[1]
Specifications
OEMDisco[2]—
Model321[2]—
Equipment typeWafer Dicing Saw[2]—
Facility contextCleanroom Instrumentation[2]—
Application areaNano and Micro Fabrication[2]—
LocationFNT 4.106[2]—
Wafer SizeUp to 6 inches[3]—
Spindle Power1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[4]—
Spindle Power (alternate)1500 Watt spindle[3]—
Non-Contact SetupNon Contact Setup[4]—
MicroscopeMicroscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[4]—
Broken Blade DetectionBroken Blade Detection[4]—
Light TowerIncludes Light Tower[4]—
Chuck Type6" Universal Chuck (or 6" Porous Film Frame Chuck)[3]—
Wafer size capabilityUp to 6" wafers[4]—
Chuck6-inch porous film frame chuck[3]—
Spindle power1500-watt spindle[3]—
FootprintSmall footprint[3]—
SetupNon-contact setup[4]—
Blade break detectionBroken blade detection[4]—
Other featuresFloppy drive, light tower, blade tools, manuals[4]—
Configuration—3 Chucks[5]
Phase—200-2008 V, 50 A, 50/60 Hz, 3 Phase[5]
Voltage—208 V[6]
Wafer size—12 inch[5]
Process type—Cassette to Cassette[5]
Number of chucks—3[5]
Current—50 A[5]
Frequency—50/60 Hz[5]
Add-on chiller—DTU 1531[5]
Accessories—USV, Duct Unit, Vacuum Unit[5]
Vintage year—2012[7]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]tmi.utexas.edutmi.utexas.edu
  3. [3]jmind.comjmind.com
  4. [4]gtsaz.comgtsaz.com
  5. [5]inventory listing
  6. [6]waferpedia.comwaferpedia.com
  7. [7]tarasemi.comtarasemi.com