Waferpedia

Comparison ledger

1000 Hot PlateversusHMO-50

CEE 1000 Hot Plate, Heller HMO-50, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
HMO-50Heller
OEMCEEHeller
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 1000 Hot PlateHeller HMO-50
Specifications
Configuration4"[1]Horizontal in-line with magazine loader, unloader, and return conveyor system[2]
TypeHot Plate[1]—
Wafer Size4 inch[1]—
Machine type—Horizontal in-line magazine curing oven[2]
Material handling—Magazine loader and unloader[2]
Conveyor system—Magazine return conveyor system[2]
Oven Dimensions (W x D x H)—3300 mm x 1650 mm x 2500 mm[3]
Loader Dimensions (W x D x H)—1050 mm x 1500 mm x 2100 mm[3]
Unloader Dimensions (W x D x H)—1400 mm x 1500 mm x 2100 mm[3]
Bypass Dimensions (W x D x H)—3000 mm x 500 mm x 950 mm[3]
Total Dimensions (with loaders and bypass) (W x D x H)—5400 mm x 2000 mm x 2500 mm[3]
Max Operating Temperature—150°C[3]
Temperature Uniformity (on product)—±5°C[3]
Heating Method—Forced air convection[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]sinerji-grup.comsinerji-grup.com