Waferpedia

Comparison ledger

1000 Hot Plateversus1809 MK III SMT

CEE 1000 Hot Plate, Heller 1809 MK III SMT, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMCEEHeller
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 1000 Hot PlateHeller 1809
Specifications
Configuration4"[1]50/60 Hz[2]
TypeHot Plate[1]—
Wafer Size4 inch[1]—
Voltage—220V[2]
Make—Heller[2]
Model—1809 MK III[2]
Product type—SMT Reflow Oven[2]
Heating zones—9 heating zones (top and bottom, forced convection)[4]
Cooling zones—2[4]
Heated tunnel length—105 cm (254 cm)[4]
Large PCB width—20 cm (50.8 cm)[4]
Power input—3 phase, standard 480 volts[4]
Frequency—50/60 Hz[2]
Typical net weight—4350 lbs. (1970 kg)[4]
Temperature range—60-350 C standard[4]
Maximum temperature—Up to 450 C[4]
Temperature control accuracy—+/- 0.1 C[4]
Cross-belt temperature tolerance—+/- 2.0 C[4]
Heater wattage per zone—6000 W[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]efsmt.comefsmt.com