Waferpedia

Comparison ledger

1000 Hot PlateversusLCC 1-16 NV 3

CEE 1000 Hot Plate, Despatch LCC 1-16 NV 3, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMCEEDespatch
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 1000 Hot PlateDespatch LCC 1-16 NV 3
Specifications
Configuration4"[1]—
TypeHot Plate[1]—
Wafer Size4 inch[1]—
Max. Temp—260 C / 500 F[2]
Power—240 V, Single Phase, 50/60 hz[2]
Heater—3000 watts, 12.5 A[2]
Motor—1/4 HP, 1.2 A[2]
Electrical Connection—240 V[2]
Max Temperature—260 °C / 500 °F[2]

Plan your fab

Building a Thermal / Diffusion process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing