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Comparison ledger

Anelva ILD 4100 SR Dryversus100 ICP Fluorine

Canon Anelva ILD 4100 SR Dry, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100 ICP FluorineOxford Instruments
OEMCanonOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCanon AnelvaOxford Instruments 100 ICP Fluorine
Cited variants—
Specifications
ConfigurationOxide[2]—
Etch Gases—SF6, CF4, O2, Ar, N2, CHF3, C4F8[3]
Cryo DRIE etch rate—up to 5 µm/min[3]
Wafer size—4 inch, 6 inch, 8 inch (with clamp change)[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]nanofab.utah.edunanofab.utah.edu