Waferpedia

Comparison ledger

PowerPro 3000versus15 Lapper

Buehler PowerPro 3000, Lapmaster 15 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15 LapperLapmaster
OEMBuehlerLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBuehler PowerPro 3000Lapmaster 15
Specifications
ConfigurationVariable speed[1]Equipped with:[2]
TypeGrinder/Polisher[1]—
Speed controlVariable speed[1]—
Number Of Conditioning Rings—Up to 3[2]
Ring ID—Up to 5.5″[2]
Plate Diameter – Outside—15″[2]
Plate Diameter – Inside—3 1/2″[2]
Standard RPM—60[2]
Drive Motor—1/2 HP[2]
Electrics—110V / 1Ph / 60Hz[2]
Dimensions – Approximate—26″(L-R) x 21″(F-B) x 22″(H)[2]
Equipped with: 15″ Cast Iron Plate—Included[2]
Equipped with: (3) Yoke/Roller Bearing Assemblies—Included[2]
Equipped with: (3) Conditioning Rings—Included[2]
Equipped with: (3) Hold Downs—Included[2]
Equipped with: 30 Minute Timer—Included[2]

Plan your fab

Building a CMP process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing