Comparison ledger
Brewer Science B2, EV Group EVG 150, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | B2Brewer Science | EVG 150EV Group |
|---|---|---|
| OEM | Brewer Science | EV Group |
| Category | Lithography | Lithography |
| Wafer size | 100mm | 100mm |
| Process node | DUV | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | i-line |
| Family | Brewer Science B2 | EV Group EVG 150 |
| Specifications | ||
| Type | Developable BARC[1] | — |
| Name in ACT-8 process list | B2 DUV42P[1] | — |
| Configured wafer size on ACT-8 | 100 mm (4") wafers[1] | — |
| Tool type | — | Modular cluster tool for coating and development of i-line photoresists[2] |
| Loading/unloading ports | — | Two loading/unloading ports: one cassette for coating and one cassette for development[2] |
| Wafer centering | — | Optical wafer centering station[2] |
| Spin-coating modules | — | Three spin-coating modules: coater A, coater B, and coater C[2] |
| Coater A use | — | Low-viscosity photoresist[2] |
| Coater B use | — | High-viscosity photoresist[2] |
| Coater C use | — | Bottom layers[2] |
| Development module | — | One development module with puddle and spray options[2] |
| Hotplates and coolplates | — | Three stacks of hotplates (8 in total) and coolplates (3 in total)[2] |
| HMDS priming | — | Additional HMDS-priming module[2] |
| Robot | — | Dual end effector robot[2] |
| Wafer handling | — | Standard SEMI-wafers of 100 mm and 150 mm diameter[2] |
| Substrate types | — | Opaque wafers (silicon, SOI) or transparent wafers (glass, fused-silica, sapphire)[2] |
| Process stability features | — | Airborne molecular contamination (AMC) filter and active control of chamber and resist/developer lines temperature[2] |
| Available photoresists | — | AZ ECI 3007, AZ ECI 3027, AZ 1512 HS, AZ nLOF 2020, AZ nLOF 2070, MC PC62E[2] |
| Available bottom layers | — | LOR 5A, LOR 15C, XHRiC-16 II[2] |
| Surface preparation options | — | HMDS, dehydrate, or none[2] |
| Solvent clean options | — | Standard or edge bead removal (EBR)[2] |
| Developer chemistries | — | AZ 726 MIF, AZ 400K 1:3.5, AZ developer III[2] |
| wafer diameter | — | 100mm and 150mm[2] |
| loading/unloading ports | — | Two (one cassette for coating, one for development)[2] |
| wafer centering station | — | Optical wafer centering station[2] |
| spin-coating modules | — | Three (coater A: low-viscosity PR, coater B: high-viscosity PR, coater C: bottom layers)[2] |
| development module | — | One, with both puddle and spray options[2] |
| hotplates | — | Three stacks, 8 in total[2] |
| coolplates | — | Three stacks, 3 in total[2] |
| additional module | — | HMDS-priming module[2] |
| wafer types | — | Opaque (silicon, SOI) or transparent (glass, fused-silica, sapphire)[2] |
| process enhancement | — | AMC filter and active control of chamber and resist/developer line temperature[2] |
| Wafer sizes | — | 100mm and 150mm diameter[2] |
| Loading ports | — | Two loading/unloading ports[2] |
| Hotplates | — | Three stacks, 8 total[2] |
| Coolplates | — | Three total[2] |
| HMDS-priming module | — | Included[2] |
| Wafer types | — | Opaque (silicon, SOI) and transparent (glass, fused-silica, sapphire)[2] |
| AMC filter | — | Airborne molecular contamination filter on top[2] |
| Temperature control | — | Active control of chamber and resist/developer lines temperature[2] |
| Photoresists available | — | AZ ECI 3007, AZ ECI 3027, AZ 1512 HS, AZ nLOF 2020, AZ nLOF 2070, MC PC62E; bottom layers: LOR 5A, LOR 15C, XHRiC-16[2] |
| Wafer size | — | 100mm and 150mm[2] |
| Photoresist type | — | i-line[2] |
| Process enhancement | — | Airborne molecular contamination filter and active control of chamber and resist/developer line temperature[2] |
| Priming module | — | Additional HMDS-priming module[2] |
| Wafer diameter | — | 100 mm and 150 mm diameter[2] |
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