Comparison ledger
Branson 101-149-053 Gold Booster, West Bond 7476 D 79, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101-149-053 Gold BoosterBranson | 7476 D 79West Bond |
|---|---|---|
| OEM | Branson | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Branson 101-149-053 Gold Booster | West Bond 7476 |
| Specifications | ||
| Configuration | 1:1.5[1] | Olympus SZ 51-60 Microscope[4] |
| Manufacturer | Branson[2] | — |
| Model | 101-149-053[2] | — |
| Type | Gold Booster[2] | — |
| Operating frequency | 20 kHz[3] | — |
| Gain | 1:1.5[2] | — |
| Mounting thread | 1/2-20[3] | — |
| Length | 5.4 in[3] | — |
| Gain ratio | 1:1.5[2] | — |
| Bonding technique | — | manual wedge-wedge wire bonding[5] |
| Minimum bond pad size | — | 50 µm[5] |
| Maximum bond sites before wire parting | — | 21[5] |
| Wire diameter range | — | 0.0007–0.002 inches (17.8–50.8 µm)[5] |
| Supported wire materials | — | aluminum and gold[5] |
| Current wire configuration | — | 0.00125-inch (31.75 µm) aluminum wire[5] |
| Ultrasonic frequency | — | approximately 63 kHz[5] |
| Aluminum wire bonding temperature | — | room temperature[5] |
| Gold wire bonding method | — | heated-stage thermosonic bonding[5] |
| Microscope | — | Olympus SZ 51-60[4] |
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