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Comparison ledger

101-149-053 Gold Boosterversus7367E

Branson 101-149-053 Gold Booster, West Bond 7367E, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
7367EWest Bond
OEMBransonWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBranson 101-149-053 Gold BoosterWest Bond 7367E
Specifications
Configuration1:1.5[1]Dual-head[4]
ManufacturerBranson[2]—
Model101-149-053[2]7367E[4]
TypeGold Booster[2]Manual Die Bonder[4]
Operating frequency20 kHz[3]—
Gain1:1.5[2]—
Mounting thread1/2-20[3]—
Length5.4 in[3]—
Gain ratio1:1.5[2]—
Series—7372E · 7367E · 7374E Series[4]
Construction—Gantry construction[4]
Motion—Orthogonal motions rather than pivoted[4]
Axis brakes—Individual axis brakes[4]
ESD protection—Included[4]
Head operation—Heads used alternately to pick up chips, then rotate, place, and bond them[4]
Head configuration—Detachable heads[4]
Manipulator—Three-axis micromanipulator[4]
Workpiece handling—All machine mechanism arrayed above the work plane[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]nextdayautomation.comnextdayautomation.com
  4. [4]cltrep.comcltrep.com