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Comparison ledger

101-149-053 Gold BoosterversusGemini

Branson 101-149-053 Gold Booster, EV Group Gemini, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
GeminiEV Group
OEMBransonEV Group
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBranson 101-149-053 Gold BoosterEV Group Gemini
Cited variants—
Specifications
Configuration1:1.5[2]—
ManufacturerBranson[3]—
Model101-149-053[3]—
TypeGold Booster[3]—
Operating frequency20 kHz[4]—
Gain1:1.5[3]—
Mounting thread1/2-20[4]—
Length5.4 in[4]—
Gain ratio1:1.5[3]—
Bond force (300 mm GEMINI)—up to 350 kN[5]
Bond force (200 mm GEMINI)—up to 100 kN[5]
Overpressure capability (300 mm GEMINI)—up to 2000 mbar[5]
Overpressure capability (200 mm GEMINI)—up to 3000 mbar[5]
Wafer sizes (200 mm GEMINI)—100 mm to 200 mm[5]
Wafer sizes (300 mm GEMINI)—200 mm to 300 mm[5]
Max number of bond chambers—up to 4 bond modules[5]
Pre-process modules (200 mm GEMINI)—up to 4 pre-process modules[5]
Pre-process modules (300 mm GEMINI)—2 to 6 pre-process modules[5]
Load ports (200 mm GEMINI)—EVG load ports or SMIF load ports[5]
Load ports (300 mm GEMINI)—FOUP load ports (optional adapter for 200 mm substrates)[5]
Bond alignment system—Field-proven SmartView® bond alignment system[5]
Wafer-to-wafer alignment accuracy (GEMINI FB)—sub 50 nm[1]
Max number of process modules (GEMINI FB)—6 + SmartView® NT[1]
Wafer diameter (GEMINI FB)—200, 300 mm[1]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]evgroup.comevgroup.com
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]nextdayautomation.comnextdayautomation.com
  5. [5]evgroup.comevgroup.com