Waferpedia

Comparison ledger

22 AD 42versus782-6

Blanchard 22 AD 42, Kulicke & Soffa 782-6, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
22 AD 42Blanchard
782-6Kulicke & Soffa
OEMBlanchardKulicke & Soffa
CategoryDicing & GrindingDicing & Grinding
Wafer size—6"
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 22 AD 42Kulicke & Soffa 782-6
Specifications
Phase3 Phase[1]—
Frequency60 Hz[1]—
Voltage120 Vac[1]—
ConfigurationNo coolant tank[1]—
Maximum wafer size—up to 6" wafers[2]
Maximum wafer thickness—800 µm thick[2]
Materials diced—Si, Glass, Quartz, SiC, Sapphire, LiNbO3[2]
Kerf width—down to 50 µm (blade dependent)[2]
Blade cooling and rinsing—DI water[2]
Category—Dicing & Grinding[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  3. [3]waferpedia.comwaferpedia.com