Comparison ledger
Blanchard 20 36 Surface, Takatori WSD K 3, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 20 36 SurfaceBlanchard | WSD K 3Takatori |
|---|---|---|
| OEM | Blanchard | Takatori |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Blanchard 20 36 Surface | Takatori WSD K 3 |
| Specifications | ||
| Configuration | With new Elecro-Matic Neutrol II Magnetic Chuck Control[1] | Capable of handling substrates that include:[2] |
| Magnetic Chuck Control | Electro-Matic Neutrol II[1] | — |
| Capable substrates | — | Silicon Carbide (SiC), Sapphire, Quartz crystal and optical materials, Compound semiconductors (GaAs, GaN, InP)[2] |
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