Waferpedia

Comparison ledger

20 36 SurfaceversusR07

Blanchard 20 36 Surface, Disco R07, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
R07Disco
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size—up to Φ8”
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceDisco R07
Cited variants—
  • R07-SDC600-BB101-75[1]
  • R07-SD400-BB200-75[1]
  • R07-SDC400-BB300-75[1]
  • R07-SDC400-BB500-75[1]
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[2]—
Magnetic Chuck ControlElectro-Matic Neutrol II[2]—
Model—DAD3241[3]
Max. workpiece size—Φ8”[3]
X-/Y-axis cutting range—210 mm[3]
Cutting speed—0.1-800 mm/s[3]
Index positioning accuracy—0.002/210 mm[3]
Z-axis max. stroke—32.2 mm[3]
Moving resolution—0.000002 mm[3]
Repeatability accuracy—0.001 mm[3]
Θ-axis max. rotating angle—320°[3]
Rotation speed range—6,000-60,000 rpm[3]
Spindle power—1.8 kW[3]
Type—Resin bond blades[1]
Applications—Glass, quartz, ceramics, etc.[1]
Major uses—Glass (borosilicate glass, non-alkali glass), crystal, ceramics, QFN, metal, quartz, alumina, LTCC, aluminum nitride[1]
Wafer size—up to Φ8”[3]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]disco.co.jpdisco.co.jp
  2. [2]inventory listing
  3. [3]aggiefab.tamu.eduaggiefab.tamu.edu