Comparison ledger
Blanchard 20 36 Surface, Disco DGP 8760 + DFM 2800, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 20 36 SurfaceBlanchard | DGP 8760 + DFM 2800Disco |
|---|---|---|
| OEM | Blanchard | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Blanchard 20 36 Surface | Disco DGP 8760 |
| Specifications | ||
| Configuration | With new Elecro-Matic Neutrol II Magnetic Chuck Control[1] | Fully automatic[2] |
| Magnetic Chuck Control | Electro-Matic Neutrol II[1] | — |
| Wafer Sizes | — | 8, 12 inch[2] |
| Fully automatic | — | Yes[2] |
| Power | — | 200 Vac, 3 Phase[2] |
| Inline UV irradiation system | — | Present[2] |
| Pre-Cut Dicing Tape | — | Yes[2] |
| Finish thickness min with wafer polishing | — | Up to 50ums[2] |
| Minimum finish thickness with wafer polishing | — | 50 µm[2] |
| Operation type | — | Fully automatic[2] |
| Configuration options | — | Stand-alone BG or in-line with wafer mounter[2] |
| Vintage year | — | 2009[2] |
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