Waferpedia

Comparison ledger

18 D SurfaceversusGLP-150

Blanchard 18 D Surface, Takatori GLP-150, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
GLP-150Takatori
OEMBlanchardTakatori
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceTakatori GLP-150
Specifications
Voltage416 V[1]—
Phase3 Phase[1]—
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[1]—
Model18 D[1]—
Asset #153970[1]—
Power416 V, 3 phase[1]—
Structure—High rigidity[3]
Accuracy—Outstanding thickness accuracy in any materials[3]
Grindstone adaptability—Adaptable to various grindstones[3]
Automation—Adopted to automation[3]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]takatori-g.co.jptakatori-g.co.jp