Comparison ledger
Blanchard 18 D Surface, Disco DGP 8761 DFM 2800 Back, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 18 D SurfaceBlanchard | |
|---|---|---|
| OEM | Blanchard | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | 2 Independent loadports, 25 wafer front opening unified pod (FOUP) carrier |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Blanchard 18 D Surface | Disco DGP 8761 |
| Specifications | ||
| Voltage | 416 V[1] | 200 VAC[3] |
| Phase | 3 Phase[1] | 3 Phase[3] |
| Cycles | 50[1] | — |
| Control Voltage | 110[1] | — |
| Make | Blanchard[1] | — |
| Model | 18 D[1] | DGP 8761 / DFM 2800[3] |
| Asset # | 153970[1] | — |
| Power | 416 V, 3 phase[1] | 200 VAC, 3 Phase[3] |
| Full Load Current | — | 72 A[3] |
| Wafer size | — | 2 Independent loadports, 25 wafer front opening unified pod (FOUP) carrier[4] |
| Configuration | — | Pedestal style with vacuum[4] |
| OEM | — | Disco[3] |
| Equipment type | — | Back Grinder[3] |
| Loadports | — | 2 independent loadports[4] |
| Carrier | — | 25 wafer front opening unified pod (FOUP) carrier[4] |
| Wafer handling robot | — | Wafer handling robot[4] |
| Wafer alignment system | — | Wafer alignment system with capability for notch detection and precise alignment[4] |
| Vacuum style | — | Pedestal style with vacuum[4] |
| Wafer ID reader | — | Included[4] |
| Chuck cleaning system | — | Included[4] |
| Porous vacuum chucks | — | 4[4] |
| Independent transfer arms | — | 2[4] |
| Wet grind spindles | — | 2 independent wet grind spindles[4] |
| Dry polish spindle | — | Included[4] |
| Grind wheels | — | 2[4] |
| Polishing wheel | — | Included[4] |
| Spin-dry station | — | Included[4] |
| Tape-side wash | — | For clean post grind[4] |
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