Waferpedia

Comparison ledger

200 ACUversus2300 Selis

Axcelis 200 ACU, Lam Research 2300 Selis, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
2300 SelisLam Research
OEMAxcelisLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Lam Research 2300 Selis
Cited variants—
  • 2300 SELIS - Chamber Only[1]
Specifications
ConfigurationParts Machine[2]Chamber Only[1]
ManufacturerAxcelis[2]—
Model200 ACU[2]2300 Selis[6]
Tool typeAsher[2]—
Wafer size200mm[4]12 inch[6]
Serial numberAU6A356AH[4]—
Computer systemM 200 PC, M 200[5]—
Part numberSC 4572 A[5]—
Volts208[5]—
Amps30[5]—
Equipment typeAsher[2]Etch chamber[6]
Wafer configuration8 inch[3]—
OEM / manufacturer—Lam Research[6]
Category—Etch[7]
Process / description—Dielectric Etch – Process Chamber[1]
Version—300 mm[1]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]fabsurplus.comfabsurplus.com
  2. [2]inventory listing
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]wotol.comwotol.com
  5. [5]semistarcorp.comsemistarcorp.com
  6. [6]Equipment inventory listing
  7. [7]waferpedia.comwaferpedia.com