Comparison ledger
ASML Twinscan XT 1250 D, EV Group 101, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | |
|---|---|---|
| OEM | ASML | EV Group |
| Category | Lithography | Lithography |
| Wafer size | Continuous clampable wafer table for dry WSs: Absent | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASML Twinscan XT 1250 | EV Group 101 |
| Specifications | ||
| Configuration | with Cymer XLA165[1] | — |
| Track Pre-warning signal (APR)s | APR enabled[1] | — |
| Active wafer release for dry WSs | FALSE[1] | — |
| Wafer size | Continuous clampable wafer table for dry WSs: Absent[1] | — |
| Wafer Stage Configurations | Wafer Stage type 2 configuration[1] | — |
| Wafer Carrier Locations | Right[1] | — |
| Wafers per Carriers | 25[1] | — |
| Wafer Mark Sensors | Absent[1] | — |
| Wafer Id Readers | Absent[1] | — |
| Wafer Tracks | Present[1] | — |
| Wafer Stage Types | Dual Chuck[1] | — |
| Wafer Stress Relaxations | FALSE[1] | — |
| Lower Docking Plates | Present[1] | — |
| WS Balance Masss | Stainless Steel[1] | — |
| WH Robot Power Amplifiers | CPM 20[1] | — |
| Light source | Cymer XLA165[1] | — |
| Wafer stage type | Dual Chuck[1] | — |
| Wafer configuration | Dry[1] | — |
| Carrier handler type | Mark I 300 Foup[1] | — |
| Wafer handling load & unload robot type | Double Fold Arm, 12 mm Z stroke[1] | — |
| Reticle stage measurement system on scans | Heidenhain Encoders[1] | — |
| Reticle stage chuck type | Glued Leafspring, TYPE_2: Glued LS, Pneum. GC, IFM / ENC[1] | — |
| Integrated reticle inspection system | PPD1 with IRIS1 functionality[1] | — |
| Reticle size | 6 inch[1] | — |
| Wafers per carrier | 25[1] | — |
| Wafer stage balance mass | Stainless Steel[1] | — |
| Interferometer axis version at exposures | 3 plus 1 axis[1] | — |
| Universal Prealignments | Disabled[1] | — |
| Wafer Handling Pneumaticss | Dedicated[1] | — |
| OEM | — | EV Group[2] |
| Model | — | 101[2] |
| Equipment name | — | EVG 101 Spray Coater[2] |
| NEMO ID | — | evgspraycoat[2] |
| Training required | — | EVG 101 Training[2] |
| Training duration | — | 1.50 hours[2] |
| Processing technique | — | Resist Spray Coat (manual)[2] |
| Cleanliness | — | "All"[2] |
| Location | — | SNF Paul G Allen L107 Cleanroom[2] |
| Wafer diameter (substrate size) | — | up to 300 mm[3] |
| Available modules | — | Spin coat / OmniSpray® / develop[3] |
| Wafer handling options | — | Bowed / warped / thin wafer handling, edge handling[3] |
| Dispense options | — | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[3] |
| Processing technique (at SNF) | — | Resist Spray Coat (manual)[4] |
| Cleanliness group (at SNF) | — | "All"[2] |
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