Waferpedia

Comparison ledger

VIISTA Trident XP Ion ImplantversusNV 8250

Applied Materials VIISTA Trident XP Ion Implant, Axcelis NV 8250, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Ion Implantation, Unknown[1]
Side-by-side comparison of selected equipment models
Attribute
NV 8250Axcelis
OEMApplied MaterialsAxcelis
CategoryIon ImplantationIon Implantation
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials VIISTAAxcelis NV 8250
Specifications
Process TypeStandard[2]—
Scan HarnessStandard - Continuous[2]—
BeamlineXP[2]—
ProfilerGen II Multipixel 2 piece cup[2]—
Process Chamber Line KitFull Coverage[2]—
Seismic KitSeismic[2]—
ChillerSMC Remote 20M[2]—
Differential pumpingStandard[2]—
Cryo PumpOBIS 320FX w/ IS2000V(1) PSI[2]—
Cryo Pump Facilities POCSS Cryo Exh UP-Rough. DN-Hel.DN[2]—
Power KitStd w/3 Pole 175A[2]—
UPSStandard UPS 3KVA[2]—
Facilities (Air-N2-H2O)Faci fr Bott w Manifold - Std[2]—
Frequency60 Hz Operation[2]—
Injector KitXP (LDPL) Vapo Ready[2]—
Control systemw/ Hard disk drives[2]—
Label KitChinese Label Kit[2]—
Load Lock VentStandard Finish[2]—
Load Lock Vent ConnectionVent Connection Std Finish[2]—
Elevator Chamber selectionStandard - TGV w/Peek[2]—
OEMApplied Materials / Varian[2]—
ModelVIISTA Trident XP[2]—
Orienter SelectionLaser - Belt drive 300mm[2]—
Remote Harness Kit20M-Rem Harn/Heli-IS2000V[2]—
Roughing Pump SupplyCustomer Supplied Pumps Onsite[2]—
Rough Pump TypeEdwards iGX100MTi - iGX100L[2]—
Rough Pump ExhaustUniversal RP Exh - Floor[2]—
Turbo Pump SupplyCustomer Supplied Pumps Onsite[2]—
Turbo Pump TypePfeiffer HI-PACE 2300[2]—
Wafer Handler Side Window KitSide Window Kit[2]—
VCS Software Package VersionVCS 9.XX (Latest revision)[2]—
Plasma Flood GunXP-Standard Gas Box[2]—
Gas Box10 Position[2]—
Gas Box Exhaust10 Stk GB Dual Exh FM4910 - Up[2]—
ManometerQuad Mano 10Stk GB 0-1000 Pa[2]—
Gas Stick Slot 1HP Ar/N2 CGA 580[2]—
Gas Stick Slot 2PraxAir Boron VCR 1/4[2]—
Gas Stick Slot 3PraxAir Arsine[2]—
Gas Stick Slot 4PraxAir Phosphine - NSR[2]—
Gas Stick Slot 5Praxair CO[2]—
Gas Stick Slot 6PraxAir GeF4 - NSR[2]—
Gas Stick Slot 7Praxair Boron VCR 1/4[2]—
Gas Stick Slot 8XeH2[2]—
Gas Stick Slot 9HP N2 CGA 580[2]—
Purge Assembly Slot 7 & 10N2 w/Ext Fd - 10 Stick[2]—
SS gaskets for all gas sticks10 stick gas box[2]—
Argon External Purge AssemblyAr Ext Purge w/Reg (Pos1)-Std[2]—
Control Systemwith Hard disk drives[2]—
Wafer Handling (Orienter)Laser - Belt drive 300mm[2]—
Configuration—Backside[3]
Wafer Sizes—8 inch[1]
Energy Range—0-250 keV[1]
Power Requirement—208 VAC, 100 A, 50/60 Hz, 3 Phase[1]
Programmable Auto Tilt—0-75 degrees[1]
Single Stage Extraction—15-40 keV[1]
Ion Source Type—ELS[1]
Source Material Type—Moly[1]
Electrostatic Chuck (ESC)—Yes[1]
Parallel Beam using Hybrid Scanning—Yes[1]
90 degrees Radially Indexed Dipole Magnet—Yes[1]
Signal Tower—Yes[1]
SECS II / GEM Interface—Yes[1]
Cassette Interface—Asyst Bolt-On SMIF (2), Cassette Stages (3), Automatic Flat/Notch Alignment, Programmable Flat Orient[1]
Controller—Sun Sparc Station V, Application SW Ver. 4.3.2, Auto Start-Up & Computer Monitoring[1]
Pump / Cryogenics—Source Pump: TMP; Beam Pump: TMP (2) and Cryo Pump (8" Torr, Non On-board); End Station Pump: 2 Cryo Pump (8" Torr, Non On-Board); Cryo Compressor: CTI 8500; Remote Disk Chiller[1]
Gas Configuration—AsH3 - SDS, PH3 - SDS, BF3 - SDS, Ar - HP[1]
Energy Filter System Option—Yes[1]
Vintage—1999 (Backside)[3]
Source Pump—TMP[1]
Beam Pump—TMP (2)[1]
End Station Pump—2 Cryo Pump (8" Torr, Non On-Board)[1]
Cryo Compressor—CTI 8500[1]

Plan your fab

Building a Ion Implantation process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]inventory listing