Comparison ledger
Applied Materials Mirra, PR Hoffman 108T, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | MirraApplied Materials | 108TPR Hoffman |
|---|---|---|
| OEM | Applied Materials | PR Hoffman |
| Category | CMP | CMP |
| Wafer size | Platen3 - Wafer Buff | up to 12 in wafers |
| Process node | — | — |
| Introduced | — | — |
| Production run | 2000– | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Mirra | PR Hoffman 108T |
| Cited variants | — | |
| Specifications | ||
| Software | MP2B6.2_28[1] | — |
| Configuration | 3 Polish Platens:[1] | — |
| Wafer size | Platen3 - Wafer Buff[1] | — |
| OEM | Applied Materials[1] | — |
| Model | Mirra[1] | — |
| Equipment type | CMP (Chemical Mechanical Polisher)[1] | — |
| Polish platens | 3[1] | — |
| Platen 1 | STD polish[1] | — |
| Platen 2 | STD polish[1] | — |
| Platen 3 | Wafer Buff[1] | — |
| Polish heads | 4[1] | — |
| Flow controllers | Entegris[1] | — |
| Robot arm | Applied Materials[1] | — |
| Vintage | 1999[1] | — |
| carrier type listing | — | 108T 9B - S/F / Lapmaster LSP-9 / etc.[4] |
| machine class | — | for double-sided planetary lapping & polishing machines[4] |
| wafer sizes stated on insert-carrier page | — | 3 in, 4 in, 5 in, 6 in, 8 in, and 12 in wafers[4] |
| maximum carrier diameter stated on insert-carrier page | — | up to 33 in diameter[4] |
| maximum carrier diameter stated on lapping-carrier page | — | up to 48 in diameter[5] |