Waferpedia

Comparison ledger

0720 06060 PartversusNextest Magnum V SSV FT Memory

Applied Materials 0720 06060 Part, Teradyne Nextest Magnum V SSV FT Memory, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0720 06060 PartApplied Materials
OEMApplied MaterialsTeradyne
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0720 06060 PartTeradyne Nextest Magnum
Specifications
ConfigurationContact Pin 24-20 Awg Crimp Gold Flash[1]With VP Manipulator[2]
Quad Site Assembly Configuration (qty16)—800 Mbps, HSBx, DPS128, 17[2]
ECR or DBM Memory Option (qty 16)—64GBIT, ECR, OR, DBM, MS[2]

Plan your fab

Building a Test & Probe process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing