Waferpedia

Comparison ledger

0041-39086 ESC Partversus901G

Applied Materials 0041-39086 ESC Part, Tegal 901G, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0041-39086 ESC PartApplied Materials
901GTegal
OEMApplied MaterialsTegal
CategoryEtchEtch
Wafer size—75 mm to 150 mm round substrates; square and rectangular substrates
Process node——
Introduced—1999
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Tegal 901G
Specifications
Tool type—diode plasma etcher[1]
Configuration—special configuration for GaAs processing[1]
Configured features—special sensors and electrode designs[2]
Intended applications on platform—pad, zero layer, non-selective nitride, backside, planarization, oxide, nitride, poly, and III-V materials applications such as GaAs[2]
Substrate sizes on platform—75 mm to 150 mm round substrates as well as square and rectangular substrates[2]
Equipment Type—Diode plasma etcher[1]
Process—Plasma etching[1]
Substrate Size—75 mm to 150 mm round substrates; square and rectangular substrates[2]
Series—900 series[1]
Installed Base (900 Series)—More than 1,300 systems worldwide[1]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.org