Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, SUSS MicroTec SB8E, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | SB8ESUSS MicroTec |
|---|---|---|
| OEM | Applied Materials | SUSS MicroTec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | Windows NT |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | SUSS MicroTec SB8E |
| Specifications | ||
| Tool type | — | VAC substrate bonder[1] |
| Maximum wafer size | — | up to 150mm[1] |
| Vacuum level | — | down to 5x10e-5 mbar[1] |
| Overpressure | — | up to 3 bar[1] |
| Bonding processes | — | Anodic Bonding, Silicon Fusion Bonding, Adhesive Bonding, Thermal Compression Bonding[1] |
| Heating | — | Double-side heating up to 550 Degrees Celsius[1] |
| Power supply | — | 0 to +/- 2000 VDC with maximum current at 15mA[1] |
| Control software platform | — | Windows NT[1] |
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