Waferpedia

Comparison ledger

0041-26723 Bonded AssemblyversusSE 130 DU CI Injection

Applied Materials 0041-26723 Bonded Assembly, Sumitomo SE 130 DU CI Injection, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsSumitomo
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblySumitomo SE 130 DU CI Injection
Cited variants—
  • SE 130 DU-CI[1]
  • SE 130 DU CI Double Shot[2]
Specifications
Configuration—Double Shot[2]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing