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Comparison ledger

0041-26723 Bonded Assemblyversus705

Applied Materials 0041-26723 Bonded Assembly, MRSI 705, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
705MRSI
OEMApplied MaterialsMRSI
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyMRSI 705
Specifications
Configuration—Magazine to Magazine[1]
Type—Die Bonder[1]
Material Handling—Magazine to Magazine[1]
Heating Stages—4 Stage Ramp-up Heating[1]
Holder Type—Manual Loading Gelpak Holder[1]
Head Configuration—Single Head[1]
Pick-Up Type—Gripper Type[1]
Bondforce Capability—High Bondforce Capable[1]
Vintage—2014[1]
Equipment type—Die bonder[1]
Heating—4 stage ramp-up heating[1]
Loading—Manual loading[1]
Holder—Gelpak holder[1]
Bond type—Gripper type[1]
Bondforce—High bondforce capable[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]inventory listing