Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Kulicke & Soffa IConn MEM Plus, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | IConn MEM PlusKulicke & Soffa |
|---|---|---|
| OEM | Applied Materials | Kulicke & Soffa |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Kulicke & Soffa IConn MEM Plus |
| Specifications | ||
| Ultra Fine Pitch | — | 35 μm[1] |
| Gold wire diameter | — | 0.6 mil to 2.0 mil[1] |
| Silver alloy wire diameter | — | 0.6 mil to 2.0 mil[1] |
| Bonding Area (X) | — | 56 mm[1] |
| Bonding Area (Y) | — | 80 mm[1] |
| Total Bond Placement Accuracy | — | 2.0 μm @ 3 sigma[1] |
| Maximum Wire Length (1.0 mil wire) | — | 7.6 mm[1] |
| Maximum Wire Length (0.6 mil wire) | — | 3.0 mm[1] |
| Minimum Loop Height (0.6 mil wire) | — | 40 μm[1] |
| Input Voltage | — | 200-240 VAC, single phase, 50/60 Hz[1] |
| Power Consumption (nominal) | — | 1.5 KVA[1] |
| Power Consumption (max) | — | 2.6 KVA[1] |
| Footprint | — | 889 mm x 1009 mm (35" x 39.7")[1] |
| Weight (machine only) | — | 620 kg (1367 lbs)[1] |
| Minimum Air Pressure | — | 3.52 kg/sq cm (50 psi)[1] |
| Nominal Air Consumption | — | 185 liters/min @ 4.6 kg/sq cm (6.5 CFM @ 65 psi)[1] |
| Cover Gas Consumption (nominal) | — | 0.9 liters/min[1] |
| Setup Time (same leadframe type) | — | < 4 min[1] |
| Setup Time (different leadframe type) | — | < 8 min[1] |
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