Waferpedia

Comparison ledger

0020 18455 Partversus3290 STQ

Applied Materials 0020 18455 Part, Novellus 3290 STQ, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 18455 PartApplied Materials
3290 STQNovellus
OEMApplied MaterialsNovellus
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 18455 PartNovellus 3290
Specifications
ConfigurationShaft,Rf In Local Match, Hdpcvd,Rev3[1]Recent model control system[2]
Phase—3 Phase[2]
Frequency—50 Hz[2]
DC Power Supply—12 / 12 / 12 kW, 208 V[2]
Load Lock Pump—Varian V 70 Turbo Pump[2]
Wafer Size—6 inch[3]
Power Supply Phase/Frequency—3 Phase, 50 Hz[2]
Optional DC Power Supply—6 / 6 / 12 kW, 208 V (option for 12 /12 / 12 kW AE Pinnacle at 400 V)[2]
Control System—Recent model control system with touch screen from both sides[2]
Temperature Controller—Latest version[2]
Cryo Pumps—CTI Cryo Pumps[2]
Water Pumps—Included[2]
Mass Flow Controllers—Upgrade to MFC vs. needle valve[2]
Pressure Controller—New[2]
Preheating—Installed Heater for Preheating (no RF Etch Position)[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]Equipment inventory listing