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Comparison ledger

0020 17485 PartversusEndura 300 Aluminum Interconnect

Applied Materials 0020 17485 Part, Applied Materials Endura 300 Aluminum Interconnect, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
0020 17485 PartApplied Materials
Endura 300 Aluminum InterconnectApplied Materials
OEMApplied MaterialsApplied Materials
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 17485 PartApplied Materials Endura 300 Aluminum Interconnect
Specifications
ConfigurationStrap, RF Out 2 Balanced Coil Match, Hdp[1]—
Process—Physical Vapor Deposition (PVD)[2]
Wafer Size—300 mm (12 inch)[2]
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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing