Comparison ledger
Applied Materials 0020 12458 Part, Applied Materials P 5000 Mark II, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0020 12458 PartApplied Materials | P 5000 Mark IIApplied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Deposition | Deposition |
| Wafer size | — | Wafer Orienter |
| Process node | — | — |
| Introduced | — | 1991 |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0020 12458 Part | Applied Materials P 5000 Mark II |
| Cited variants | — | |
| Specifications | ||
| Configuration | Insulator,Side Match,Hdp-Cvd Ultima Plus[6] | DxZ[1] |
| Asset number | 146526[6] | — |
| Make | Applied Materials[6] | — |
| Model | 0020 12458[6] | P 5000 Mark II[1] |
| Software | — | b6.02[3] |
| Install Type | — | Through Wall[4] |
| Wafer size | — | Wafer Orienter[4] |
| Phase | — | Phase 3 Robot[4] |
| Storage Elevator | — | 29 slots[4] |
| Floppy Drive | — | 3 1/2[4] |
| Gas Panel Type | — | 28[4] |
| Load Lock Pump | — | Edwards iH 80 Series[4] |
| Voltage | — | 208VAC 50/60Hz[5] |
| Qty 3 - DLH Delta PECVD Silane | — | Silane Oxide Deposition[9] |
| Qty 3 - DLH PECVD Silane | — | Silane Oxide Deposition[10] |
| Wafer Size (6 inch) | — | 6 inch[4] |
| Wafer Size (8 inch) | — | 8 inch[1] |
| Process | — | Plasma-Enhanced Chemical Vapor Deposition (PECVD)[1] |
| Chamber A | — | Silane SiO2 PECVD standard 200mm chamber[5] |
| Chamber B | — | Silane SiN PECVD standard 200mm chamber[5] |
| Software Version | — | b6.02[3] |
| Power | — | 208VAC 50/60Hz[5] |
| Robot | — | Phase 3[4] |
| Cassette Handler | — | Phase 3[4] |
| Wafer Orienter | — | Yes[4] |
| Gas Lines | — | N2, He, N2O, NH3, 2% SiH4/Bal He, CF4[4] |
| Position A | — | Silane DCVD[4] |
| Position B | — | Silane DCVD[4] |
| Position C | — | Silane DCVD[4] |
| Position D | — | Empty[4] |
| RF Match Type | — | Phase IV[4] |
| Lid Type | — | Bolddown[4] |
| Endpoint | — | Standard[4] |
| Line 1 | — | N2, 3000 sccm, Brooks 5850 / 5964[4] |
| Line 2 | — | He, 5000 sccm, Ditto[4] |
| OEM | — | Applied Materials[1] |
| Process type | — | PECVD (Plasma-Enhanced Chemical Vapor Deposition)[1] |
| Wafer sizes | — | 8 inch[1] |
| Wafer orienter | — | Present[4] |
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