Waferpedia

Comparison ledger

0010 47763versus900ACS

Applied Materials 0010 47763, Tegal 900ACS, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
900ACSTegal
OEMApplied MaterialsTegal
CategoryEtchEtch
Wafer size—75mm to 200mm wafers
Process node——
Introduced——
Production run——
Lifecycle—Legacy
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763Tegal 900ACS
Cited variants—
Specifications
Configuration2nd Source New[2]—
TypeMonopolar Dual Heated[3]—
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[4]—
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[3]—
Model0010-47763[2]—
OEMApplied Materials[2]—
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[3]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[3]—
Quantity available (source)1[3]—
tool type—single wafer cassette-to-cassette etch system[1]
process type—non-critical plasma etch[1]
wafer range—75mm to 200mm wafers[1]
series—ACS series[1]
features—faster throughput, faster system calibration, touchscreen graphical user interface, integrated data logging, and factory automation support[1]
throughput—faster throughput[1]
system calibration—faster system calibration[1]
user interface—touchscreen graphical user interface[1]
data logging—integrated data logging[1]
automation support—factory automation support[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]inventory listing
  3. [3]saulcontrol.comsaulcontrol.com
  4. [4]getspares.comgetspares.com