Comparison ledger
Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, SUSS MicroTec SB6 / 8 Gen2, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedApplied Materials | SB6 / 8 Gen2SUSS MicroTec |
|---|---|---|
| OEM | Applied Materials | SUSS MicroTec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | Gen2 |
| Family | Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated | SUSS MicroTec SB6 / 8 Gen2 |
| Specifications | ||
| Configuration | Refurbished[1] | — |
| Wafer size | — | up to 200 mm[2] |
| Automation | — | Semi-automated[2] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →