Comparison ledger
Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, EV Group 540, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedApplied Materials | 540EV Group |
|---|---|---|
| OEM | Applied Materials | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated | EV Group 540 |
| Specifications | ||
| Configuration | Refurbished[1] | Anodic bond, fusion bond, adhesive bond[2] |
| Wafer sizes | — | 6, 8 inch[2] |
| Maximum substrate size | — | 300 mm[3] |
| Bond force | — | up to 350 kN[3] |
| Bonding types | — | Anodic bond, fusion bond, adhesive bond[2] |
| Automation | — | Semi automatic (4 stations) / Fully automated single-chamber[4] |
| Bond tools included | — | (4x) 8" tools, (4x) 6" tools, (1x) 4" tool[2] |
| Maximum bond chambers | — | 1[3] |
| Compatible alignment systems | — | SmartView and MBA300[3] |
| Maximum heater size | — | 300 mm[3] |
| Loading chamber | — | 2-axis robot[3] |
| Max. bond chambers | — | 1[3] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →