Comparison ledger
Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, ASM M Feeder II, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedApplied Materials | M Feeder IIASM |
|---|---|---|
| OEM | Applied Materials | ASM |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated | ASM M Feeder II |
| Specifications | ||
| Configuration | Refurbished[1] | Configured for Manual Panel Loading[2] |
| Bondhead Type | — | Single bondhead with 4 arms[2] |
| System performance - XY placement | — | ± 0.4 mil (10 um) @ 3g[2] |
| System performance - Die rotation | — | ±1° @ 3g[2] |
| System performance - Global array angle | — | ±0.01o[2] |
| System performance - Bonding cycle | — | 72 ms[2] |
| Die size | — | 90 x 90 - 500 x 500 um[2] |
| Die thickness | — | 3.5 x 3.5-19.7 x 19.7 mil / Min 50 um[2] |
| Input material | — | Standard JEDEC tray[2] |
| No. of tray handling | — | 2[2] |
| Carrier size | — | Max 60 x 60 x 1.5mm (With 50 x 50mm effective bonding area)[2] |
| Wafer type | — | Foton ring[2] |
| Wafer ring size (OD) | — | 7.33"[2] |
| Expanded wafer size | — | 5.9"[2] |
| PR system - Image mode | — | Color[2] |
| PR system - Grey level | — | 256 grey level[2] |
| Voltage | — | 220 Vac, Single Phase[2] |
| Optional voltage | — | 110 Vac[2] |
| Frequency | — | 50/60 Hz[2] |
| Compressed air | — | 6 bar[2] |
| Air consumption | — | 700 LPM @ 6bar[2] |
| Vacuum pump | — | Option[2] |
| Full load current | — | 24A @ 220V[2] |
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