Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, LPKF U 4 Proto, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | U 4 ProtoLPKF |
|---|---|---|
| OEM | Applied Materials | LPKF |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | LPKF U 4 Proto |
| Specifications | ||
| Make | Applied Materials[1] | — |
| Model | 0010-22161[1] | — |
| Description | HTESC PH 1 REV A[2] | — |
| Condition | Used[2] | — |
| Stock Number | BM6628[2] | — |
| Laser class | — | 1[3] |
| Max material size (X x Y x Z) | — | 229 mm x 305 mm x 10 mm (9" x 12" x 0.4")[3] |
| Laser wavelength | — | 355 nm[3] |
| Laser pulse frequency | — | 25 kHz – 300 kHz[3] |
| Structuring speed | — | 200 mm/s (7.8"/s) on 18 μm / ½ oz Cu on FR4[3] |
| Cutting speed | — | 200 mm/s (7.8"/s) for 0.5 mm (0.02") FR4*[3] |
| Diameter of focused laser beam | — | 20 μm[3] |
| Minimum line / space | — | 50 μm/20 μm (2 mil/0.8 mil), on laminated substrate (18 μm Cu)[3] |
| Accuracy | — | ± 1.98 μm (± 0.08 mil) mechanical resolution scanfield[3] |
| Dimensions (W x H x D) | — | 910 mm x 1650 mm x 795 mm (35.8" x 65" x 31.3"); height with open door 1765 mm (69.5")[3] |
| Weight | — | 340 kg[3] |
| Electrical consumption | — | 110 V – 230 V; 1.4 kW[3] |
| Required compressed air supply | — | Min. 6 bar (87 psi), min. 230 l/min (8.12 cfm)[3] |
| Laser source power | — | up to 6 W[4] |
| Calibration | — | better than 10 μm across 9" x 12" working area/vacuum table[4] |