Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, Lam Research Exelan Flex, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | Exelan FlexLam Research |
|---|---|---|
| OEM | Applied Materials | Lam Research |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2018 Manufacture date |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | Lam Research Exelan Flex |
| Cited variants | — | |
| Specifications | ||
| Make | Applied Materials[3] | — |
| Model | 0010-22161[3] | Exelan Flex[5] |
| Description | HTESC PH 1 REV A[4] | — |
| Condition | Used[4] | — |
| Stock Number | BM6628[4] | — |
| OEM | — | Lam Research[5] |
| Asset description | — | Lam Exelan Flex Chamber[5] |
| Wafer size | — | 12 inch[5] |
| Configuration | — | 2300 Exelan Flex 300mm configuration[6] |
| Process type | — | Oxide Etch[6] |
| Vintage | — | 2005[6] |
| Tool description | — | 2300 Exelan Flex FX - Chamber Only[1] |
| Current configuration | — | 300mm[1] |
| Status | — | Available[1] |
| Date of manufacture | — | 2018-01-01[2] |
| Configured for | — | To be determined[2] |
| Process module | — | 2300 FLEX GX OPTIONS[2] |