Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, KLA UV 1050 Film Thickness, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | |
|---|---|---|
| OEM | Applied Materials | KLA |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | KLA UV 1050 Film Thickness |
| Specifications | ||
| Make | Applied Materials[1] | — |
| Model | 0010-22161[1] | — |
| Description | HTESC PH 1 REV A[2] | — |
| Condition | Used[2] | — |
| Stock Number | BM6628[2] | — |
| Optics type | — | Broadband UV[3] |
| Measurement technique | — | Dual beam spectrophotometry[3] |
| Light source | — | Broadband Xenon Arc Lamp[3] |
| Stage resolution (xy) | — | 0.25 µm[4] |
| Stage resolution (z) | — | 0.025 µm[4] |
| Wafer sizes | — | 100 mm, 125 mm, 150 mm, 200 mm[5] |
| Number of discrete wavelengths | — | over 500[3] |
| Imaging system | — | Color camera[3] |
| Focus | — | Automatic focus on measurement site[3] |
| Operating system | — | Windows NT[3] |
| Software | — | Summit Software with GUI[3] |