Waferpedia

Comparison ledger

0010-18024 Pyrometer AssemblyversusP 11 Surface

Applied Materials 0010-18024 Pyrometer Assembly, KLA P 11 Surface, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsKLA
CategoryMetrology & InspectionMetrology & Inspection
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-18024 Pyrometer AssemblyKLA P
Specifications
ConfigurationCapable of working on Applied Materials Radiance[1]—
Process—Bump[2]
Vertical measurement range—under 100 Å (0.4 min.) to approximately 300 µm (11 mils)[3]
Vertical resolution—0.5, 2, or 10 Å[3]
Wafer size capability—Up to 8 inch / 200 mm[3]
Measured parameters—Roughness, waviness, step height, and other surface characteristics[3]
Programmable repeat scans—Up to ten times with automatic averaging[3]
Data visualization—Photo-realistic 3D rendering of scan data[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]classoneequipment.comclassoneequipment.com