Waferpedia

Comparison ledger

0010-16392 ESC Assemblyversus903e

Applied Materials 0010-16392 ESC Assembly, Tegal 903e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-16392 ESC AssemblyApplied Materials
903eTegal
OEMApplied MaterialsTegal
CategoryEtchEtch
Wafer size—75 mm to 150 mm round substrates; rectangular substrates from 100 mm to 125 mm on a side
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—2000 sale announced · 2001 order announced
Control system——
Generation——
FamilyApplied Materials 0010-16392 ESC AssemblyTegal 903e
Specifications
OEMApplied Materials[1]—
Model0010-16392[1]—
TypeESC Assembly[1]—
Wafer Size300 mm[2]—
Electrode ConfigurationDual[2]—
Tool type—diode plasma etch tool[3]
Substrate diameter range—75 mm to 150 mm round silicon and gallium arsenide (GaAs) substrates[3]
Substrate format—rectangular substrates from 100 mm to 125 mm on a side[3]
Wafer/substrate capacity—75 mm to 150 mm round substrates[3]
Rectangular substrate capacity—100 mm to 125 mm on a side[3]
Configured form—"through the wall" configuration[5]
Application—etching oxide contacts[3]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]spwindustrial.comspwindustrial.com
  3. [3]web.archive.orgweb.archive.org
  4. [4]web.archive.orgweb.archive.org
  5. [5]web.archive.orgweb.archive.org