Comparison ledger
Applied Materials 0010-13622 RF Match for, Denton Vacuum SJ20C, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | SJ20CDenton Vacuum |
|---|---|---|
| OEM | Applied Materials | Denton Vacuum |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Denton Vacuum SJ20C |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | — |
| Model | 0010-13622[1] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Tool owner | — | Jim Pierce[2] |
| Serial number | — | 18097[2] |
| Description | — | Film thickness monitor/deposition controller[2] |
| Deposition method | — | E-beam evaporation[2] |
| Source hearths | — | 4 source hearth[2] |
| Evaporation materials available | — | Al, Ag, Au, Au/Ge, Cr, Cu, Ge, Mo, NiCr, Nb, Ni, Ta, Ti, W[2] |
| Crucible liner types | — | Poco Graphite crucible liners (large & small); Cu crucible liners[2] |
| Process | — | E-beam evaporation / physical vapor deposition[2] |
| Crucible pockets | — | 4[3] |
| Crucible liner guidance | — | Do not fill crucible over 1/3 full[3] |
| Deposition controller settings | — | Density and Z-Ratio are programmed for the material to be deposited[3] |
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