Comparison ledger
Applied Materials 0010-13622 RF Match for, Denton Vacuum 635LL, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | 635LLDenton Vacuum |
|---|---|---|
| OEM | Applied Materials | Denton Vacuum |
| Category | Deposition | Deposition |
| Wafer size | — | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Denton Vacuum 635LL |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | — |
| Model | 0010-13622[1] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Cathodes | — | 4-cathodes[2] |
| Gas / process feedback | — | RGA, OES-feedback reactive oxygen or nitrogen sputter[2] |
| Chuck temperature | — | heated/cooled chuck to 500C[2] |
| Process mode | — | co-sputtering[2] |
| Substrate size | — | coats up to 200mm diameter substrates[2] |
| Number of cathodes | — | 4[3] |
| Residual gas analysis (RGA) | — | Included[3] |
| Reactive sputtering feedback | — | OES-feedback reactive oxygen or nitrogen sputter[3] |
| Chuck temperature range | — | Heated/cooled to 500 °C[3] |
| Co-sputtering capability | — | Yes[3] |
| Maximum substrate size | — | 200 mm diameter[3] |
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