Comparison ledger
Applied Materials 0010-03485 Magnet Assy, KLA Zeta 20, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03485 Magnet AssyApplied Materials | Zeta 20KLA |
|---|---|---|
| OEM | Applied Materials | KLA |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-03485 Magnet Assy | KLA Zeta 20 |
| Specifications | ||
| Configuration | WP AL 300mm PVD[1] | — |
| OEM | Applied Materials[1] | — |
| Model | 0010-03485[1] | — |
| Description | MAGNET ASSY, WP AL 300MM PVD[2] | — |
| Process | PVD[3] | — |
| Wafer size | 300mm[4] | — |
| Version | Spares[4] | — |
| Part Number | 0010-03485[1] | — |
| Manufacturer | Applied Materials[1] | — |
| Process Type | PVD (Physical Vapor Deposition)[1] | — |
| Application (Material) | Aluminum (AL)[1] | — |
| Wafer Diameter (associated) | 300 mm[1] | — |
| Type | — | Fully integrated optical profiling microscope[5] |
| Measurement capability | — | 3D metrology and imaging[5] |
| Operating mode | — | Non-contact 3D microscope and surface topography measurement system[5] |
| Technology | — | ZDot technology[5] |
| Optics | — | Multi-Mode optics[5] |
| Measurement techniques | — | White light interferometry, phase shifting interferometry, Nomarski interference contrast microscopy, shearing interferometry, and broadband reflectometry[5] |
| Film thickness measurement | — | Transparent film thickness measurement[5] |
| Applications | — | Sample review and automated defect inspection[5] |
| Environment | — | Supports both R&D and production environments[5] |
| Measurement range | — | Step heights from nanometers to millimeters[6] |
| Surface characterization | — | Surface roughness measurement for smooth and rough surfaces[6] |
| Objective lenses | — | Objective lenses up to 50x[7] |
| Software functions | — | Sample mapping, image stitching, and automated feature detection[7] |
| Sample load mode | — | Manual sample load[6] |
| Tool type | — | Fully integrated optical profiling microscope[5] |
| Metrology capability | — | 3D metrology and imaging[7] |
| Measurement technology | — | ZDot technology[5] |
| Measurement mode | — | White light interferometry[5] |
| Additional measurement techniques | — | Confocal microscopy, vertical scanning interferometry, phase shifting interferometry, thin film reflectometry, and differential interference contrast imaging[7] |
| Operating environments | — | R&D and production environments[5] |
| Film thickness range | — | Transparent film thickness from 30nm to 100µm[5] |
| Defect inspection capability | — | Capture defects greater than 1µm[5] |
| Wafer handling | — | Manual sample load[6] |
| Maximum objective lens | — | Up to 50x[7] |
| Intro year | — | 2007[8] |