Comparison ledger
AJA ATC 2036 E, Applied Materials 0010-13622 RF Match for, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ATC 2036 EAJA | 0010-13622 RF Match forApplied Materials |
|---|---|---|
| OEM | AJA | Applied Materials |
| Category | Deposition | Deposition |
| Wafer size | 15-20” adjustable length from source to wafer | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | AJA ATC | Applied Materials 0010-13622 RF Match for |
| Specifications | ||
| Wafer size | 15-20” adjustable length from source to wafer[1] | — |
| Configuration | Temescal Multu-Pocket Rotary E-Beam Source[1] | High Efficiency HE RF Match-Bias[2] |
| Chamber Front | Double hinged door with locking mechanism[1] | — |
| Model | — | 0010-13622[2] |
| Product Type | — | RF Match for PVD (Physical Vapor Deposition)[2] |
| Feature | — | High Efficiency HE RF Match-Bias[2] |
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