Comparison ledger
Accretech W-GM-4200 Wafer Edge, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | W-GM-4200 Wafer EdgeAccretech | 15Lapmaster |
|---|---|---|
| OEM | Accretech | Lapmaster |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | 150mm | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech W-GM-4200 Wafer Edge | Lapmaster 15 |
| Specifications | ||
| Voltage | AC200V +-5% 3ø[1] | — |
| Power Consumption | 5.0 KVA[1] | — |
| Main Air Source | 0,56Mpa[1] | — |
| Spindle Air Source | 0,56Mpa[1] | — |
| Grinding and Cleanig Water | 15L/min, 0.3Mpa, 18°C recommended[1] | — |
| Mist Exhaust | 5m3/min[1] | — |
| Wafer size | 150mm, 200mm[1] | — |
| Wafer Thickness | 0,4-1,0mm[1] | — |
| Wafer type | Wafer with OF or notch[1] | — |
| Notch Angle | 89deg – 95deg[1] | — |
| Notch Angle Setting Value | 0,001deg step[1] | — |
| Grinding Unit | Left/Right[1] | — |
| Grinding wheel | For Periphery and for Notch[1] | — |
| Periphery Grinding wheel speed | 2500m/min (wheel 200mm, at 4000rpm)[1] | — |
| Configuration | Rotational Frequency of Spindle for Notch: 70000-94000rpm[1] | — |
| Driving System for Peripheral Grinding | Built-in by inverter motor[1] | — |
| Driving System for Notch Grinding | Air bearing system[1] | — |
| Input Power | — | 110 Vac[2] |
| Plate Diameter | — | 15 inches (381 mm)[3] |
| Number of Conditioning Rings | — | 3[3] |
| Ring ID | — | 5.5 inches (140 mm)[3] |
| Standard RPM | — | 60[3] |
| RPM Range (Variable Speed Drive) | — | 0-60[3] |
| Drive Motor - Lapper | — | 0.5 HP (0.37 kW)[3] |
| Drive Motor - Polisher | — | 0.75 HP (0.56 kW)[3] |
| Length | — | 25 inches (635 mm)[3] |
| Width | — | 20 inches (508 mm)[3] |
| Height | — | 24 inches (610 mm)[3] |
| Estimated Shipping Weight | — | 285 lbs (129.3 kg)[3] |
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