Waferpedia

Comparison ledger

UF 200 SversusTS2000-IFE

Accretech UF 200 S, MPI TS2000-IFE, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
UF 200 SAccretech
OEMAccretechMPI
CategoryTest & ProbeTest & Probe
Wafer size200mm200mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech UF 200MPI TS2000-IFE
Specifications
AirOver 0.45 MPa[1]—
VacuumOver -53K MPa[1]—
Voltage208 VAC, Single Phase[1]—
Frequency50/60Hz[1]—
Wiring Configuration2Wire + Ground[1]—
Full Load AMPS7.2A[1]—
Main Breaker Rating10A[1]—
Interrupt Current10KA A.I.C[1]—
Diagram NumberFE06000[1]—
ConfigurationYield Check Function[1]—
Loader, Wafer HandlingBackside Holding[1]—
Wafer Size5",6",8", Currently 8"(200mm) Configured[1]—
X/Y axisProbing Area(±120mm), Maximum Speed(200m/s)[1]—
Power ConsumptionApproximately 1.5kVA[1]—
Air Supply Source Pressure0.45Mpa or more[1]—
ManipulatorMHF300L[1]—
Weight (Main Body)900kg (Standard)[1]—
Base tool—MPI TS2000-IFE 200-mm automated probe station[2]
Precision—micron precision[2]
Probe types in standard configuration—two RF probes of GSG, GSSG or GSGSG types[2]
Included instruments—microscope and digital camera[2]
Thermal chuck temperature range—-60°C to +200 °C[2]
Motion/control—probes, microscope, and chuck are automatically controlled in x, y, and z directions with optical feedback[2]
RF VNA—Anritsu 4-Port ME7838G vector network analyzer capable of a single sweep from 70 kHz to 220 GHz[2]
DC bias supply—up to 12 DC bias can be supplied by an Agilent 4156C probe station precision semiconductor parameter analyzer capable of +/-200 V, 0.5 A, and 100 V/us pulses[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]cnf.cornell.educnf.cornell.edu