Comparison ledger
ABM -407B-1-S-CES293 Robot, Nitto MSA 840 Wafer Mounter, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ||
|---|---|---|
| OEM | ABM | Nitto |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-1-S-CES293 Robot | Nitto MSA 840 Wafer Mounter |
| Cited variants | — |
|
| Specifications | ||
| Model | ABM-407B-1-S-CES293[2] | — |
| Description | ROBOT[2] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[2] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[2] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[2] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[2] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[2] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[2] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[2] | — |
| Applicable wafer size | — | 4", 5", 6", 8"[1] |
| Applicable frame size | — | for 6", for 8"[1] |
| Throughput (approx.) | — | 30 sec/wafer (excluding wafer and frame setting time and wafer mount frame removing time)[1] |
| Dimensions (W x D x H) | — | 800 x 670 x 750 mm[1] |
| Weight | — | approx. 135 kgf[1] |
| Power supply | — | Single-Phase AC100V[3] |
| Air pressure | — | 0.3-0.5 MPa[3] |
| Applicable wafer thickness (Contact Table) | — | 200 µm or more[3] |
| Applicable wafer thickness (Non-Contact Table) | — | 250 µm or more[3] |
| Static eliminator | — | 1 Fan type & 2 brush type[1] |
| Taping speed control | — | Variable by manual setting[1] |
| Taping tension | — | H/L auto changing with tape Dia. H/L Variable by manual setting[1] |
| Cut number counter | — | Equipped[1] |
| Cutting dia. detection | — | Available[1] |
| Cutting miss detection | — | Available[1] |
| Optional function | — | Magnetic holder can be added in case of using high adhesive tape[1] |
| No wafer operation | — | Tape applying on dicing frame without wafer[1] |
| Touch Panel | — | 3.8 inch[1] |
| Work holding system | — | By vacuuming[1] |
| Wafer table | — | Non contact table available[1] |
| Type | — | Semi automatic type to set wafer and frame manually and to do tape applying, cutting and removing waste tape automatically[1] |